Passive and active component design

  • Multi-element and aspheric lenses
  • Optical fiber and waveguide structures
  • All-fiber components – couplers and Bragg gratings
  • Micro-optic components and optical assemblies
  • Mechanically and thermally tuned devices

Lasers and optical systems

  • Fiber lasers and amplifiers
  • Fiber-based assemblies and systems
  • Opto-electronic sensing and instrumentation

Test and measurement

  • Optical front ends
  • Optoelectronic and vision-based measurements
  • Environmental controls
  • Automated sequencing and parametric characterization

Zemax and physical modeling

  • Zemax sequential, non-sequential and physical propagation
  • CAD integration
  • Ad-hoc models

Electronics and firmware

  • Low power mixed signal circuit design
  • USB galvanic isolation
  • Design for test and design for manufacturing
  • EMC compliance
  • PCB layout and rapid prototyping


  • Opto-electronic integration
  • Enclosures
  • Firmware and software


  • Customized, intelligent computer-controlled stations
  • Process automation
  • Pneumatics/motion/sensors/vision
  • Electronics and software
  • Data management

Assembly stations

  • Vision and parametrically driven motorized actuation
  • UV cure, inductive and laser reflow
  • Dispensing automation
  • Accurate micro gripper design and contact sensing
  • Custom electronics and actuation solutions
  • Sequencing and full software automation

Mechanical design

  • Solid modeling
  • Detailed drawing and sourcing
  • BOM generation

Machining and rapid prototyping

  • In-house 3D printing of plastic composites
  • In-house 3-axis Benchman XT for precision milling with 40k RPM spindle
  • Extensive network of close collaborators offering high precision machining and finishing with fast turn around (aluminum, stainless, brass, copper, ceramics, kovar, invar, plastics etc.)

Finite element analysis

  • Strain/stress
  • Thermal modeling
  • Computational flow dynamics


  • Manufacturing line optimization and setup
  • NPI including:
    • Product and process documentation and KPIs
    • Staff training in preproduction environment
    • Technology transfers
    • Supplier management

Packaging and encapsulation

  • Materials and processes: adhesives, solders, glasses, ceramics, plastics, alloys, composites, plating and vacuum coatings, reflows, curing, plasma cleaning
  • Hermetic sealing, polymer seals and molecular sieve moisture/hydrogen management
  • Thermal stress management
  • Fiber optic and micro-optic component package design
  • Laser and detector pigtailing
  • Fiber optic module design, fiber management solutions and assembly processes

Laser power handling

  • Packaging design for multi-kW lasers, components and fiber cables
  • Package atmosphere management
  • Optical loss thermal management solutions
  • Stepped stress plans and failure analysis

Failure mode analysis

  • SEM, AFM, cross-sectional analysis
  • Hermeticity issues, fine leak testing, internal vapor analysis
  • Fiber fractography analysis
  • Documentation and reporting
  • Customer interface, liability estimates, corrective action plans


  • Proof testing
  • Hermeticity qualification and controls
  • Burn-in and stress testing
  • Sampling methodology

Reliability predictions

  • Low FIT (0.1FIT) designs, analysis and test plans for critical deployments
  • Failure data analysis and plotting – Log-Normal, Weibull, etc.
  • Fiber integrity and reliability predictions based on the power law model
  • Reliability test plans and qualification
  • Product maintenance through reliability estimates and failure mode analysis