• Multi-element and aspheric lenses
  • Optical fiber and waveguide structures
  • All-fiber components – couplers and Bragg gratings
  • Micro-optic components and optical assemblies
  • Mechanically and thermally tuned devices
  • Fiber lasers and amplifiers
  • Fiber based assemblies and systems
  • Opto-electronic sensing and instrumentation
  • Quantum computing optical modules
  • Optical front ends
  • Optoelectronic and vision-based measurements
  • Environmental controls
  • Automated sequencing and parametric characterization
  • Zemax sequential, non-sequential and physical propagation
  • CAD integration
  • Ad-hoc models
  • GHz bandwidth analog
  • Low noise
  • High power
  • Digital
  • FPGA and micro-controllers
  • In-house rapid prototyping
  • Opto-electronic integration
  • Enclosures
  • Firmware and software
  • Robotic micro-optic assembly
  • Customized, intelligent computer-controlled stations
  • PLC process automation
  • Pneumatics/motion/sensors/vision
  • Electronics and software
  • Data management
  • Vision and parametrically driven motorized actuation
  • UV cure, inductive and laser reflow
  • Dispensing automation
  • Accurate micro gripper design and contact sensing
  • Custom electronics and actuation solutions
  • Sequencing and full software automation
  • Solid modeling
  • Detailed drawing and sourcing
  • BOM generation
  • In-house 3D printing of plastic composites
  • In-house 3-axis Benchman XT for precision milling with 40k RPM spindle
  • Extensive network of close collaborators offering high precision machining and finishing with fast turn around (aluminum, stainless, brass, copper, ceramics, kovar, invar, plastics etc.)
  • Strain/stress
  • Thermal modeling
  • Computational flow dynamics
  • Manufacturing line optimization and setup
  • NPI including:
    • Product and process documentation and KPIs
    • Staff training in preproduction environment
    • Technology transfers
    • Supplier management
  • Optoelectronic package development, die bonding, wirebonding
  • Pigtailing of photonic integrated circuits, laser diodes, photodetectors
  • Micro-optic assemblies and package design
  • Hermetic sealing and screening
  • Polymer seals and molecular sieve moisture/hydrogen management
  • Thermal stress management
  • Materials: adhesives, solders, glasses, ceramics, plastics, alloys, composites, plating and vacuum coatings
  • Processes: plasma cleaning, curing, controlled atmosphere reflows, induction, laser
  • Packaging design for multi-kW lasers, components and fiber cables
  • Package atmosphere management
  • Optical loss thermal management solutions
  • Stepped stress plans and failure analysis
  • Biocompatible material selection
  • Autoclave resistant optics
  • Seals for liquid reprocessing
  • Endoscopes and microlenses
  • Galvanic isolation solutions
  • Fog resistant designs
  • Distal tips and laser delivery
  • Proof testing
  • Hermeticity qualification and controls
  • Burn-in and stress testing
  • Sampling methodology
  • Reliability test plans and qualification
  • Low fit (0.1FIT) designs for critical deployments
  • Statistical analysis and plotting of failures (log normal, Weibull, etc.)
  • Fiber integrity and reliability predictions based on the power law model
  • Product maintenance
  • SEM, AFM, cross-sectional analysis
  • Hermeticity issues, fine leak testing, internal vapor analysis
  • Fiber fractography analysis
  • Documentation and reporting
  • Customer interface, liability estimates, corrective action plans